Ceva, Inc. introduced the Ceva-Waves Links200, a revolutionary turnkey multi-protocol platform IP designed to support the latest Bluetooth High Data Throughput (HDT) technology, in addition to IEEE 802.15.4 for Zigbee, Thread, and Matter. The Links200 solution incorporates a cutting-edge radio developed by Ceva for TSMC’s low-power 12nm process, offering a significant time-to-market advantage by eliminating technology barriers and risks associated with developing compute-intensive smart edge SoCs requiring multi-protocol wireless connectivity based on the most recent standards for hearables, wearables, and other wireless consumer electronics.
To meet the growing market demand for faster, more efficient Bluetooth connectivity, especially for low-power audio and latency-sensitive IoT applications, the innovative High Data Throughput mode doubles the speed of traditional Bluetooth, achieving a data rate of up to 7.5 Mbps. Leveraging advanced HDT modulation schemes and Ceva’s state-of-the-art radio on TSMC’s 12nm FinFET process, Links200 ensures exceptional performance in a low-power solution. This advancement in Bluetooth technology enables lossless, multi-channel, low-latency audio streaming for various devices such as TWS earbuds, headsets, smartwatches, smart speakers, TV wireless speakers, gaming peripherals, and car audio systems, enhancing audio experiences across different platforms.
As a part of the expanding Ceva-Waves Links family, Links200 seamlessly integrates Bluetooth HDT with IEEE 802.15.4 support for Zigbee, Thread, and Matter, enabling concurrent multi-link communication through advanced coexistence schemes. The Ceva-Waves Links family offers further integration possibilities with Wi-Fi and Ultra-Wideband (UWB), enhancing the scalability and flexibility of the industry’s most comprehensive wireless portfolio. With its integration capabilities with Ceva-NeuPro-Nano NPUs, Links200 strengthens Ceva’s leadership in smart edge AI SoCs, leveraging the advanced 12nm process for efficient premium compute intelligence.
Key Features of the Ceva-Waves Links200: Full support for Bluetooth dual mode (Classic and LE), including High Data Throughput up to 7.5Mbps for lossless multichannel low latency audio streaming; IEEE 802.15.4 support for Zigbee, Thread, and Matter; Comprehensive Integration encompassing RF, modem, controller, software stacks, and profiles; Advanced Audio Support for Classic Audio, LE Audio, and Auracast Broadcast Audio; Accurate and Secure Ranging with Bluetooth Channel Sounding for precise and secure ranging; Utilization of TSMC 12nm FFC+ process for optimized performance in smart audio and Smart Edge AI SoCs; Superior Performance with best-in-class power consumption, die size, and performance, featuring state-of-the-art RF architecture requiring minimal external components for low bill of materials; Ease of Integration for fast time to market; Customizable for product differentiation through tight integration with Ceva’s sensing and inference IPs, including Ceva-NeuPro-Nano NPU, and Ceva-RealSpace Spatial Audio.
