Huawei recently unveiled its plans for the future of its Ascend chip line at the Huawei Connect 2025 event in Shanghai. Eric Xu, deputy chair of Huawei’s board, highlighted the company’s commitment to advancing infrastructure design and technologies to stay ahead in the face of challenges such as tariffs and trade embargoes.
The new Ascend chip range will include the 950, 960, and 970 series, with improved performance and capabilities. Huawei will also introduce SuperPods of NPUs, offering ready-made compute clusters to hyperscalers. Additionally, the company will release general computing chip models under the Kunpeng 950 series.
A key development is the UnifiedBus 2.0 open-source connectivity protocol, which will be used in the new SuperPods and SuperClusters. This protocol aims to meet the increasing demand for computing power and efficiency.
Overall, Huawei’s innovative approach to chip development and infrastructure design sets the stage for a new era of advanced computing technology.
