The Mobile World Congress 2026 held in Barcelona brought together leading companies in the semiconductor, wireless infrastructure, and test-and-measurement industries to showcase their latest hardware platforms, chipsets, and network engineering tools. The event featured a focus on practical engineering topics such as RF system integration, AI-assisted networking, non-terrestrial connectivity, and timing resilience for communications infrastructure. Here is a summary of some of the technologies and platforms showcased at the event.
EnSilica introduced a Ku- and Ka-Band chipset for satellite terminals, integrating RF front-end components, beamforming control, and digital processing blocks for electronically steered flat-panel antenna terminals. The chipset supports operation across multiple satellite constellations and frequency allocations, reducing the number of discrete components and lowering power consumption.
The LoRa Alliance highlighted the integration of LoRaWAN networks with AI workloads, showcasing how LoRaWAN-connected sensors incorporate local AI inference for efficient data processing and transmission. AI tools are also used in the core network to analyze traffic patterns and detect anomalies, while applications interpret location and sensor data for various use cases.
Rohde & Schwarz demonstrated test platforms for 5G-Advanced, 6G, and non-terrestrial networks, showcasing the CMX500 one-box signaling tester for emulating mobile network environments and validating device behavior. The company also presented tools supporting AI-assisted testing workflows and non-terrestrial network testing capabilities.
PCTEL and DeepSig unveiled a portable RF signal intelligence platform for spectrum monitoring and RF intelligence, integrating I/Q data streaming, cellular signal decoding, and AI-based classification. The platform supports monitoring of commercial cellular networks, public safety communications, satellite signals, and drone activity.
VIAVI showcased the ePRTC360+ holdover timing system for maintaining precise network synchronization during GNSS outages or interference, meeting ITU-T standards with a rubidium oscillator and GNSS monitoring. The company also demonstrated RF digital twins for massive MIMO networks, enabling the creation of simulated environments for validating beamforming algorithms.
Sequans introduced 5G eRedCap cellular IoT chipsets for low-data-rate and high-throughput IoT applications, along with the Iris RF transceiver and licensable intellectual property for cellular IoT deployments. TMYTEK and Metanoia presented an FR2 gNB architecture for fixed wireless access deployments, combining software-defined radio platforms with antenna-in-package modules.
Eforthink showcased a UWB positioning platform for industrial location services, integrating UWB with GNSS and Bluetooth signals for real-time tracking with high accuracy. The platform supports asset tracking, worker safety monitoring, and automated production line management in smart manufacturing environments.
MSI presented GPU-accelerated AI-vRAN platforms for virtualized radio access network functions, combining GPU resources with telecom software stacks for dynamic resource allocation. Sivers Semiconductors demonstrated a Ka-band SATCOM phased array for satellite communication ground terminals, and Nordic Semiconductor expanded its cellular IoT portfolio with LTE-M, NB-IoT, and satellite connectivity options.
Overall, the Mobile World Congress 2026 showcased a diverse range of technologies and platforms that are shaping the future of wireless communication and network infrastructure.
