Amazon and Qualcomm have joined forces to develop customised silicon for AI data centres, focusing on AI inference and high-speed optical connectivity. This collaboration will see the creation of multiple generations of silicon for Amazon’s AI infrastructure, including optical connectivity reaching speeds of up to 1.6T.
Qualcomm’s involvement adds to Amazon’s existing portfolio of AI infrastructure, which includes accelerators like Trainium and Inferentia, as well as EC2 instances powered by Nvidia GPUs. This partnership allows AWS to expand its range of processors for AI workloads.
In addition to developing custom silicon, Qualcomm and Amazon are also working on high-speed optical connectivity solutions for Amazon data centres. This collaboration extends Qualcomm’s data centre accelerator roadmap, which includes a range of AI systems like AI200, AI250, and AI300, as well as connectivity products.
The agreement between Qualcomm and Amazon includes the development of custom processors and optical connectivity technology to enhance Amazon’s AI infrastructure. This partnership aligns with Qualcomm’s broader data centre plans, which encompass CPUs, AI accelerators, customised silicon, and networking technology.
The collaboration between Qualcomm and Amazon marks a significant step in advancing AI capabilities in data centres. The development of custom silicon and high-speed optical connectivity solutions will enable Amazon to enhance its AI infrastructure and meet the growing demands of AI workloads.
